Integrated Microelectromechanical System (MEMS) Inertial Measurement Unit (IMIMU)

Processes, designs and design tools are developed to enable the monolithic integration of arrays of inertial microsensors with electronics. Accelerometers and gyroscopes, fabricated in a single CMOS process, are functional and demonstrate a single chip IMU. Two integrated post CMOS micro-machining processes are demonstrated. Thin-film microstructures are defined from the metal-dielectric stack of a conventional process. In the second process, a back-side silicon etch, followed by front-side DRIE produces bulk silicon microstructures. Accelerometer and gyroscope designs are developed with accompanying low noise electronic circuitry. Noise performance was limited to 1/f circuit noise. The chip output sensibility is set by the interface circuit design. A thermally stabilized accelerometer and circuit design is demonstrated using embedded polysilicon resistors as temperature sensors and heaters in a closed loop. Nested gyroscope topologies are demonstrated with a lateral MEMS accelerometer used as a coriolis acceleration sensor. Modeling and simulation tools that simultaneously consider the electromechanical transducer and the electronic circuit to predict system performance are developed. Electrical, electromechanical and mechanical parasitics required to enable predictive lumped parameter simulation are identified and can be extracted, enabling a designer to confidently estimate design performance prior to fabrication. Generic physics-based fault models for surface-micromachined actuators and sensors are developed that enable effective testing, diagnosis and design for manufacturability.